Used DISCO DFD 691 #9112522 for sale

DISCO DFD 691 is an industry-leading scribing and dicing equipment designed for precision wafer processing. This system enables users to quickly and accurately cut through wafers of various thicknesses and materials with superior edge quality. The unit is built for maximum productivity and features a high-powered laser, a high-resolution camera, and a friction-controlled precise cutting rail machine. The laser is used to make precise scribes and dicing lines at predetermined depths on the wafer. With this tool, the user can select the desired marking parameters and intensity to ensure optimal performance. The camera is used to capture images of the wafer surface, allowing the asset to accurately reconstruct and place the scribe lines. The camera is also used to monitor the scribing and dicing process, providing feedback to ensure that the process is kept within the desired depth and accuracy parameters. The friction-controlled precise cutting rail model is designed for maximum reliability and accuracy. It's powered by a precision servo motor and features a specialized cutting wheel. The friction control equipment ensures that the cutting pressure is consistent, enabling a precise and clean cut with minimal damage to the wafer surface. The system also features a user-friendly interface with intuitive menus for easy setup and operation. An integrated safety unit provides users with the assurance of a safe operation. Overall, DFD 691 is an excellent choice for scribing and dicing tools. It offers superior performance and productivity, and it guarantees superior quality of the cut along with superior process control. It's designed for easy use and maintenance, offering the user an optimal wafer processing solution.