Used DISCO DFG 850 #9023171 for sale

DISCO DFG 850 is a wafer grinding, lapping and polishing equipment from Japanese manufacturer DISCO Corporation. Using highly accurate software and precise control algorithms, the system is suitable for a variety of grinding, lapping and polishing processes on wafers from various materials, including Si and hard insulators. DISCO DFG850 features an advanced CNC-controlled grinding head unit made up of three grinding heads for simultaneous grinding of the front, back, and edge of the wafer. The grinding head is designed to ensure a uniform grinding surface. Additionally, the machine can be used to process wafers with an outer diameter ranging from 33 millimeters to 250 millimeters, and is capable of a maximum rotation speed of 8,000 RPM. The tool also contains a high-precision linear motor that provides accurate grinding and lapping processes without vibration. This is further supplemented with a two-axis CNC-controlled tool holder, ensuring grinding and polishing operations are always precise and accurate. The asset was designed with the latest control technology to ensure stability and repeatability of processes. To complete lapping and polishing processes, DFG-850 also includes an air-bearing spindle, which allows for high speed and fine polishing of wafers with a high degree of accuracy. A cooler unit functions to completely cool the grinding heads for extended operational life and a built-in vacuum model is included to remove debris generated during the grinding, lapping, and polishing process. In addition, DFG 850 includes a wide range of safety features to protect users from sharp objects and wafer breakage. For example, protective housing covers the grinding heads and wafer to prevent physical contact and prevent powder particles from entering the grinding chamber. The equipment is also equipped with an automatic safety device that stops machine operation in a situation where the grinding head is overloaded. DFG850 is a highly advanced and efficient system that can improve the productivity of wafer grinding, lapping, and polishing processes. With its compact design, precise grinding capabilities, and safety features, the unit is an ideal solution for a variety of wafer-related grinding, lapping, and polishing applications.