Used DISCO DFG 850 #9090405 for sale

DISCO DFG 850 Wafer Grinding, Lapping & Polishing equipment is a high-precision grinding and polishing machine with a fully-enclosed design for the semiconductor processing industry. It is equipped with a pair of high-speed, high-precision grinding wheels that can grind and lap wafers quickly and accurately. The grinding wheels are mounted on a CNC-controlled swing arm that moves in a full 360 degree arc to accurately grinding and lap both the flat and periphery surfaces of the wafer. The system also features a high-precision polishing mechanism. This interlocked polishing unit is capable of accurately lapping and polishing the surface of a wafer under pre-defined parameters to produce a mirror-like finish. The platform features an integrated vacuum machine to reduce the amount of chips generated during the lapping and polishing processes. In addition, the tool also features a continuous cleaning mechanism that keeps the wafer surfaces clean throughout the grinding and polishing process. DISCO DFG850 asset is capable of processing wafers with a range of diameter from 8-250mm. The model includes a fully automated loading function, allowing for the simultaneous loading of two wafers onto the grinding stage, and then with a single button press the equipment automatically switches to the polishing stage. This eliminates the need for manual handling of the wafer and drastically reduces the potential for contamination or misalignment. The system is equipped with a range of safety features, including an emergency stop button, safety interlocks and door safety switches. In addition, the unit is designed with acoustic and particle emissions within the norms of the European EUGR standard making it safe to operate and suitable for use in a cleanroom environment. In summary, DFG-850 Wafer Grinding, Lapping & Polishing machine is a highly precise, fully-enclosed tool with a range of advanced features, allowing it to quickly and accurately process a range of wafer sizes, while also providing a low particle emission and a safe operating environment.