Used DISCO DFL 341 #293592207 for sale

DISCO DFL 341 is a powerful scribing/dicing equipment designed for semi-conductor dicing applications. It is a computer controlled, laser-guided system equipped with advanced features for precise, repeatable results. This unit features a high precision placed optical scribe assembly which works in tandem with an integrated laser for fine-scale pattern cutting. The optical assembly is operated at high speeds with a high-precision X, Y and Z axes drive to enable 5 - 900 μm precision cutting. The cutting performance is further enhanced by the use of integrated vision and robotic arms to assist in cutting procedures. DFL 341 is also equipped with an automated dicing and wafer handling machine. This tool can be operated in two modes - a manual and an automated mode. In manual mode, each dicing run is manually set up and monitored. During the dicing run, the asset will generate an array of patterned waveforms that will be fed to the laser assembly for precise, repeatable scribing of the material. In automated mode, the model will sequentially program and execute a set of pre-defined waveforms for the dicing run. DISCO DFL 341 is designed for use in industries such as semiconductor dicing, packaging and PCB manufacture. The equipment helps manufacturers reduce costs and increase efficiency by eliminating manual labor, which can be time-consuming and susceptible to errors. The system's precision ensures a consistent, high quality finish which eliminates secondary processing and reduces cycle times. Finally, DFL 341 is equipped with a range of parameters - both general and application-specific - and can easily be integrated into existing manufacturing operations. This modular and flexible unit is capable of performing a variety of scribing and dicing tasks, dramatically reducing the cost and complexity associated with semi-conductor dicing.