Used DISCO DFL 6360 #293592202 for sale

DISCO DFL 6360
Manufacturer
DISCO
Model
DFL 6360
ID: 293592202
Dicing saws.
DISCO DFL 6360 is a scribing and dicing equipment, used widely across the semiconductor industry. It is a precision, single-wafer tool that is used to create integrated circuits. DFL 6360 is powered by a laser beam that moves across the surface of a semiconductor wafer to create its circuitry. As the beam moves, it cuts extremely fine grooves that etch out the metal layers and patterns of the circuit design. This precision allows for the mechanical abrasion and etching of the individual layers. The system's main constants include laser output power, energy, frequency, and exposure time. In addition, DISCO DFL 6360 also contains a fast-response interlock unit that stops the laser beam if any obstacle is detected. This laser control machine is designed to optimize control in order to minimize exposure of the laser and machine components to hazardous light. DFL 6360 also features an automated vision tool for highly accurate alignment of beam to wafer. This asset consists of an encoder and 2D machine vision model which precisely position components and automatically adjust the beam to trace the desired pattern on the surface of the wafer. The machine features a large area autofocus equipment to precisely measure the focus distance of the beam on the wafer as it moves across the surface. This ensures that exposure is not concentrated in a single area, which can cause problems with circuit reliability. DISCO DFL 6360 is an efficient and cost-effective scribing and dicing system. It is a rugged and powerful tool that is easy to use and maintain, while offering the highest levels of accuracy and reliability.
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