Used DISCO DFL 7020 #293626632 for sale

DISCO DFL 7020 is a high performance scribing / dicing equipment designed for semiconductor manufacturers who require superior quality and high accuracy for their wafer processing needs. It offers a comprehensive suite of features such as precision scribing, high resolution dicing, increased accuracy and repeatability, and an integrated 3-D vision system. DISCO DFL7020 is capable of achieving high precision scribing and dicing, providing industry-leading accuracy of ±0.02 μm or better. It is also equipped with an unique 5-axis X-Y-Z-O-T manipulator which allows it to accurately and quickly cut fine lines and curves as well as complex shapes. The 5-axis manipulator is then combined with a precision scribing head that has a 0.2 μm maximum resolution. This enables the unit to efficiently cut dies with high precision and accuracy. In addition, DFL-7020 is equipped with a 3-D vision machine which allows for automatic inspection of the processed wafer, ensuring the highest quality output. The vision tool is also able to detect features on the wafer that may interfere with the scribing / dicing process, such as dust and scratches, and can adjust the process accordingly. To improve the efficiency of the scribing and dicing process, DFL 7020 is equipped with a high-speed servo control asset which is capable of achieving processing speeds of up to 150mm/s. The model is optimized for a wide range of substrates and materials, including gallium nitrite (GaN), gallium arsenide (GaAs), and indium phosphide (InP). It also has the capability to process even the most complex and challenging applications. Overall, DFL7020 is an ideal equipment for semiconductor manufacturers who require precision scribing, high resolution dicing, increased accuracy and repeatability, and an integrated 3-D vision system. It is also reliable and efficient and meets the highest standards of quality and performance.