Used DISCO DFL 7020 #9283847 for sale

DISCO DFL 7020 is a scribing/dicing equipment designed for the thinning, cutting, and slicing of semiconductor wafers. This system is capable of sections as thin as 100 nm with a 70 micron optional slot size. This precision is made possible through the included mainstage scanner, beam expander, laser source, and reflector. The mainstage scanner is a high resolution, high accuracy XY type scanner, and is used for wafer movement during processing. The beam expander compensates for the intensity of the laser light by controlling the size of the light beam, thus making repairs faster and more accurate. The laser source is designed to accommodate a range of Nd:YAG lasers with wavelengths of 1064nm, 690nm, and 266nm. The reflector is designed to help reduce the divergence of light, focusing the beam for maximum efficiency. DISCO DFL7020 also includes a wafer flattening unit, a wafer protection machine, and a work realization tool. The flattening asset utilizes lapping plates of different diameters and grits to ensure a truly flat surface without any warping or surface variance. The wafer protection model shields the wafer from any high power laser beams that may be used in the process, while the work realization equipment is used for process development and image processing. The convenience and accuracy of DFL-7020 is unparalleled in the industry. Its high accuracy design and advanced laser system allow it to handle a wide variety of semiconductor wafers and packages, and its support for varying laser wavelengths ensures that it's able to perform a wide range of operations. In addition, DISCO DFL-7020 is easy to use and efficient, making it an ideal choice for high volume production.