Used DISCO DFL 7160 #293585778 for sale

DISCO DFL 7160 is a scribing and dicing equipment from DISCO Corporation that provides automated inspection and traceability of wafers. The system is equipped with an 8-bit camera and 1000x1000 pixel resolution imaging capabilities. The unit features a high-precision diamond scribing tool, which provides a repeatable scribing accuracy of 1 micron. The scribing tool is capable of cutting materials with a 30-degree diamond angle and a minimum cutting distance of 0.2 microns. The machine can handle up to 10 wafers ranging in size from 30mm to 300mm. DISCO DFL7160 can also be used to perform dicing operations. It has a group of six independent u-V linear motors that can give high precision cutting with a repeat accuracy of 0.1 mm. This enables the tool to accurately slice and dice wafers up to 300 microns thick. Furthermore, DFL-7160 has an advanced vision-based identification asset. This model can be used to read the ID marks on the wafer and detect any defects in the sample. It is also equipped with a powerful laser-scribing equipment that allows for greater flexibility when it comes to dicing complex shapes. The system also supports a wide range of image processing software and is suitable for different statistical analysis tasks. It has been tested for a variety of production systems ranging from organic and inorganic material to the most advanced semiconductor products. DISCO DFL-7160 is an ideal solution for a range of industries, ranging from LED production to semiconductor processing.