Used DISCO DFL 7160 #293636617 for sale

DISCO DFL 7160 is a high-end laser scribing and dicing equipment designed specifically for advanced semiconductor packaging, wafer-level packaging, chip-on-board, and MEMS. It is engineered to provide advanced performance, reliability and accuracy. The system is equipped with a fluid dispenser and a scanning laser head, allowing it to process a variety of materials with precision. The laser is able to scribe with a high cutting speed and accuracy, which is essential for successful die separation. The unit is capable of micro-slicing, pattern recognition, and clearing. It also includes a 2D imaging machine that has a maximum resolution of 1μm. DISCO DFL7160 can process multiple wafers simultaneously, each one up to 5 inches in diameter. Its maximum processing speed is 1000 scribed slits per second. In addition, this tool can operate in either a manual or automated mode. With the operator-assisted or robot-assisted operation, the asset can process up to six wafers at a time with precise dicing and scribing results. The integrated vision model allows precise sample positioning and validation of the accuracy of each dicing operation. The equipment offers a variety of configurations and options, such as an XY stage with a grinder, liquid dispenser, and smart scanner. This allows the system to perform a variety of operations, including batch processing, sequential processing, scribing, laser drilling, laser cutting, laser welding and more. Additionally, the unit can handle multiple types of materials, including ceramic, aluminum and glass. In terms of safety, DFL-7160's laser is capable of delivering over one megawatt of power in order to guarantee optimum cutting performance. The machine is UL compliant and features integrated abrasive-resistant safeguards, including a four-stage shutter mechanism that blocks off unexpected laser light production. Additionally, the tool has a two-layer safety cover and safety cover-lock detector to protect operators from potential injuries. DFL 7160 is a versatile, reliable and powerful Scribing / Dicing solution that's been designed especially for advanced semiconductor packaging and wafer-level applications. It offers high performance, accuracy and speed, enabling operators to achieve maximum throughput with efficient, precise and safe results.