Used DISCO DFL 7160 #293650925 for sale

DISCO DFL 7160 is a high performance "scribing/dicing" equipment from DISCO Corporation, a Japanese manufacturer of precision machine tools. This system is designed for high volume production of semiconductor wafers, optical components and other flat panel devices. DISCO DFL7160 consists of an upper and lower head with an integrated laser scanning unit and a laser based cutting head. The machine is capable of fine pitch (under 50 microns), high speed (2.0m/s) and precise cutting of a variety of materials, including sapphire and quartz. The integrated laser scanning tool allows the asset to cut 3-dimensional parts with precise edges. The scanning model is capable of continuously adjusting the laser beam angle so that cuts are precise, even when cutting parts by varying the pitch. This is particularly useful for shaping complicated parts. The equipment's cutting head uses a UV laser to precisely cut through the material, using high pressure and high speed. The pressure and speed are controlled by a fan motor, enabling the user to precisely adjust the pressure for precise cutting. The system is also equipped with a chiller unit to cool the head and thus protect the material from heat as it is cut. This helps maintain the material's integrity, ensuring the highest quality cut. Finally, an advanced software unit allows users to customize the process for a given material type, part shape and cutting strategy. This software facilitates intuitive operation and automated parameter setting. In summary, DFL-7160 is an outstanding "scribing/dicing" machine that enables precise, high-speed cutting of various materials. Its integrated laser scanning tool and advanced software allows for precise cutting, even at fine pitch. Finally, the chiller unit provides increased protection for the material being cut, enabling users to achieve the highest quality results.