Used DISCO DFL 7160 #9115075 for sale

DISCO DFL Series 7160 is a scribing / dicing equipment for wafer sawing and laser processing. It is highly versatile and offers fast and accurate processing of a wide variety of materials including silicon, glass and semiconductor substrates. The system uses a three-axis coordinate unit for precise cutting and alignment of substrates. The 7160 has a floating head to ensure optimal pressure uniformity and high throughput. It features a high-torque drive machine, a spiral cooling tool, and a 4-channel preheating asset with independent thermal control. The 7160 provides a maximum acceptable wafer size of 12-inch wafer with a maximum thickness of 2.5 mm. The flexible process monitoring, laser spot size and scribing speed settings enable the production of high-quality scriber markings. It can also be used for laser ablation of circuits or features as small as 25 µm. The 7160's advanced CCD camera integrated into the model is capable of recognizing wafer patterns and calculating scribing / dicing paths. This feature allows for precise cutting and accurate splicing. Additionally, it has fiber-optic detection that allows the laser to accurately move only when the material is present under the detector. The integrated customizable software enables the user to easily set up the equipment for automated scribing / dicing operations with the minimum setup time. It also offers a variety of process control such as temperature control, feed-forward and feedback rate control. The 7160 has a compact design and superior performance. It offers superior edge retention, clean chipping and minimal waste. The system also has dust extraction capabilities, extended life expectancy and low noise levels. With its advanced features, robustness, and flexibility, DISCO DFL Series 7160 is ideal for advanced semiconductor and medical device fabrication processes.