Used DISCO DFL 7160 #9115076 for sale

DISCO DFL 7160 is a high-performance scribing / dicing equipment that is capable of cutting and scribing semiconductor wafers with ultra-precision and reliability. It is built with a large, multi-axis indexing table that provides a highly precise platform for cuts, filled with an innovative high-precision 3D imaging and imaging controllers. This system also features an advanced scribing head that can be used for cutting and scribing applications for many types of wafers, such as SOI, TSV, MEMS, and others. To ensure the best quality and accuracy of cutting and scribing, DISCO DFL7160 is equipped with a powerful laser equipped with a tilting mirror which helps achieve precise cuts. The unit also features a high-speed Z axis, which provides high-resolution images and enables depth control for extremely accurate cuts. Additionally, the machine is equipped with two linear stages, each with its own controller, ensuring smooth motion in all directions during the scribing orcutting process. DFL-7160 also incorporates a comprehensive suite of features, including automatic focus control, beam profiling, and advanced laser control. This ensures highly accurate and repeatable cuts across a range of wafer materials and thicknesses. The tool is highly modular, providing versatile cutting and scribing capabilities and also includes a variety of options to customize the laser power levels and pulse frequency for different material types, thickness, and cutting speeds. The asset is designed for manual operation as well as for integration into existing production lines. It is ideal for semiconductor processing, integrated circuit fabrication, device prototyping, and MEMS/TSV chip manufacturing. The model also supports a wide range of materials, such as GaAs, SiGe, InP, SiN, Silicon, GaN, materials for photovoltaic applications, and many others. DFL 7160 also supports wafer sizes from 100mm to 300mm in diameter. Overall, DFL7160 scribing / dicing equipment provides highly precise and reliable cutting and scribing for many types of wafers and materials. From manual operation to automated production lines, the system is designed to streamline the cutting and scribing process with its versatile capabilities, reliable laser technology, and comprehensive list of features.