Used DISCO DFL 7160 #9120139 for sale

DISCO DFL 7160 is a scribing/dicing equipment which is used to cut and trim semiconductor materials into desired shapes or to divide them into smaller pieces. The system comprises a laser processing head and a movable stage that is used to transport and position the material. The laser processing head is equipped with a focusing lens and various sensors to monitor the process. The focusing lens is used to focus the laser beam to a spot size that can be adjusted from 0.1mm up to 5mm in diameter, in order to control the amount of energy that is delivered to the material. Additionally, the laser processing head is equipped with sensors to monitor the temperature center and the laser power in order to ensure a precise and repeatable process. Furthermore, the movable stage can be used to position the material with an accuracy of 0.1mm in order to accurately scribe or dice it. Overall, DISCO DFL7160 is a very precise and reliable scribing/dicing unit which is capable of producing highly accurate cuts in a variety of materials. It can be used for a wide range of applications including the cutting of wafers, semiconductors and other technical materials. The machine is also equipped with an advanced automation tool, which enables it to perform automated processing and improve the productivity of the process. Moreover, its various sensors, controls and monitors allow the user to adjust the process parameters in order to obtain the desired results. Finally, its precise and repeatable cuts make it an ideal solution for producing high-quality components.