Used DISCO DFL 7160 #9138221 for sale

DISCO DFL 7160 is a scribing/dicing equipment used in semiconductor fabrication. It is specifically designed for the fine processing of wafer surfaces for optical, chemical, and mechanical applications. The system has a maximum cutting speed of 15 centimeters per second with a surface finish of better than 0.1 microns RMS. The scribing/dicing machine features a high-stiffness table with X, Y, and Z axes which offers precise control over cutting position and orientation. The device is capable of trace-tracking and pre-programming operations for complex geometries with a resolution of 2.5 microns. Additionally, the machine features four sub-units that have independent temperature-controlled cutting blades. This gives the operator greater control so that they can precisely cut various materials such as flexible and rigid substrates. The device also includes an integrated vision mapping unit which offers data visualization and measurements with high accuracy. It uses a high-speed camera to track and visualize the signal/mask images on the surface of the wafer in real-time. It also includes an advanced Nd:YAG laser unit with low noise and high beam quality, suitable for most applications. The machine integrates additional capabilities such as on-the-fly cut-off compensation, active pitch-shift control and path optimization. Furthermore, the tool also includes a number of safety features such as the pressure sensing cut-off switch, which helps in preventing accidents to personnel and property. Additionally, the device is equipped with an emergency stop button, and an encryption asset to prevent unauthorized access to the model. Overall, the LED-equipped DISCO DFL7160 scribing/dicing equipment offers high-precision and high-performance cutting for a variety of materials. It is capable of accurate operations while operating in difficult conditions. The integrated vision mapping allows for data visualization with accuracy, making it a great option for wafer processing in semiconductor fabrication.