Used DISCO DFL 7160 #9155975 for sale

DISCO DFL 7160 is a high-precision, automated scribing and dicing equipment designed for use in semiconductor wafer manufacturing. The system accurately cuts into the top and bottom layers of the wafer, which are quickly and accurately cut into the desired shapes. DISCO DFL7160's powerful multi-beam laser unit is capable of scribing at up to 1000 lines per second, which allows for faster and more efficient wafer manufacturing. With the specially designed dynamic focusing lens, the machine can maintain accuracy while cutting through curved surfaces or cutting through multiple layers of wafer. DFL-7160 also includes an advanced imaging tool that allows for precise inspection of the cutting boundaries. This imaging asset also allows for real-time cut adjustments throughout the process, so that the desired cutting pattern can be precisely achieved. The model can be fully automated and includes a variety of safety features. The integrated wafer lift is designed to prevent collisions between moving parts, and the gas enclosure is designed to reduce the risk of sparks and potential fire. In addition, the equipment features an array of sensors and advanced optical recognition systems to ensure that the cutting runs smoothly and accurately. In addition to the automated cutting capabilities, DFL7160 also includes a variety of post-processing features that make it possible to further refine the cutting and inspection processes. This includes functions such as flatlapping, electrolytic polishing, and scrubbing. DFL 7160 is a highly efficient scribing and dicing system that provides an improved level of accuracy and processes larger wafers faster. With its advanced imaging and safety features, it is one of the most reliable systems currently available on the market. It is perfect for companies looking to increase their productivity and reduce their costs.