Used DISCO DFL 7160 #9160863 for sale

DISCO DFL 7160 is a scribing / dicing equipment developed by DISCO Hi-Tec, a global leader in wafer processing equipment. It is designed for precision laser processing and motion control of wafers and other substrates in the development of semiconductor devices. This system features laser beam scribing with pulse emission control, as well as dicing of substrates at speeds up to 25 thousand wafers per hour. DISCO DFL7160 is used not only for dicing the wafer, but also for cutting and scribing of various precision structures. This includes parallel line scribing, side wall profile scribing, and notch scribing, among other tasks. The laser beam scribing uses a carbon dioxide laser (wavelength of 10.6 micrometers) to achieve high precision and small depth scribing. Pulse emission control allows for the precise control of emission and widening of the beam for clean cuts and scribing. The unit is customizable, with various settings and parameters, so it can be used for different laser scribing processes. DFL-7160 can also be used for dicing of semiconductor wafers and other substrates, and it supports a variety of cutting and dicing processes. It utilizes a CO2 laser, imaging, and 3D scanning for precise cutting and dicing operations. It processes wafers at up to 25 thousand per hour, providing high-speed processing capability. The machine is designed with an intelligent control unit for predictive cutting, allowing it to adjust the cutting power to suit the material and substrate, as well as the shape and size of the die. DFL 7160 comes with an intuitive graphical user interface and offers advanced tools and features for easy operation and maintenance. It is designed for simple installation and integration into automated production lines. It has safety features for prevention of hazardous operations, such as laser beam damage. It is equipped with various I/O leads for connecting data logger and other peripheral devices. DISCO DFL-7160 is a high-precision scribing and dicing tool, suitable for wide range of applications. It is an ideal asset for laser scribing, dicing, and other precision cutting operations. Its superior performance and cutting capabilities make it an ideal choice for semiconductor device manufacturing. It is a reliable and efficient model, offering the best cutting and scribing performance at an affordable cost.