Used DISCO DFL 7160 #9163719 for sale

DISCO DFL 7160 is an automated scribing and dicing equipment from DISCO Corporation. It is designed to provide a high-precision, efficient solution for cutting needs in the semiconductor, display and medical electronics industries. DISCO DFL7160 combines a fully automated dicing tool with a digital vision inspection system. It features a 420 mm wafer chuck with a high-inflection-point disc for secure combination wafer chucking. Its duct-conditioning unit uses 24 fan-speed motors and powerful vacuums to dissipate air and humidity in the chamber to maintain a constant chip array within tight accuracy specifications. The machine also integrates an advanced FOUP-handling tool that allows for high-speed measurements with minimal contact, and a wafer-transport asset with independent servo-motors for accurate transport positioning. DISCO unique blade-shaping technology allows for cutting edge stability with a wide range of wafer materials, providing an ultra-smooth cut. The model also features an auto-leveling table for precise cutting alignment, dual brushing stations for debris collection, and single-pass/multiple-pass control to provide high dicing yield. The real-time digital vision detection equipment features a 9 MP sensor and up to 50x optical magnification with 0.1-micron resolution. It includes advanced algorithms with binary/gray-scale image comparison, bright- and dark-edge detection, and adaptive thresholding for high-accuracy process control. The system also provides programmable failure-detection logic and a PI-checker module to ensure correct part operation. The unit combines all these features to provide the best results for diaphragm-dicing precision, with an average processing speed of up to 1,800 wafers per hour. It is an ideal solution for high precision, efficient production of semiconductor components.