Used DISCO DFL 7160 #9173632 for sale

DISCO DFL 7160 is a high-precision, large-scale wafer scribing and dicing equipment specifically designed for the most demanding semiconductor device fabrication laboratories. The system features a large throughput of up to more than 2,000 wafers per hour for both multidirectional and rotational wafer patterns, making it ideal for numerous applications. It is also capable of producing an impressive array of scribed, diced and diced-out geometry wafers, as well as processing any layer material such as gallium arsenide and silicon. DISCO DFL7160 utilizes a dedicated wafer chucking unit which allows users to align wafers quickly, accurately and securely. Its scribing machine is based on XY-linear motors, resulting in excellent accuracy and repeatability throughout its range of motion, and is capable of scribing large wafer areas in seconds. This is enabled by its power supply design, which is unique in the industry. It employs separate voltage and current sources for both motors, along with incorporated feedback systems to ensure optimal performance. DFL-7160 features a two-axis automatic laser scanning which allows for higher accuracy, as well as an automotive high-pressure dicing tool for large-area wafers designed to generate extremely low-stress wafers with minimal damage. The tool also has a dedicated waste collection asset for optimized chip collection and recyclability. Furthermore, it allows for programmable z-axis cutting mechanism, which offers fine-tuning for desired chip tolerances and reduced defect rates. Overall, DISCO DFL-7160 is a powerful, user-friendly and reliable model designed to meet the needs of sophisticated wafer fabrication, with features that make it the ideal tool for large-scale wafer processing. It is especially useful for users who require precise results, high throughput and cost-efficiency.