Used DISCO DFL 7160 #9189560 for sale

DISCO DFL 7160 is a scribing equipment designed to provide an efficient solution to automated wafer slicing. This system is specifically designed for advanced wafer processing applications, such as solar cell, LED, RFID and microprocessor production. The unit utilizes high-precision cutting technology to create ultra-thin wafer slices, with individual die thicknesses ranging from 0.6 to 25 μm, allowing for tight process control in ultra-thin wafer-dicing operations. The machine also offers a wide range of closely spaced, cutting positions and sizes for maximum flexibility in a wide range of production processes. To maximize accuracy and productivity, DISCO DFL7160 incorporates an advanced auto-caliper sensor tool in the cutting head that accurately measures the thickness of the wafer to be cut during the process. This ensures that the desired cutting profile is precisely achieved with minimal post-dicing operations. The asset is further capable of automatically calibrating and adjusting the scribing head during the cutting process, further enhancing accuracy and throughput rate. For enhanced process safety, the model is equipped with a variety of safety guards that provide maximum protection for workers and components. An anti-dust tunnel is also integrated in the equipment cutting head to minimize dust accumulation, which can cause electrical shorting in delicate circuit boards. In terms of energy efficiency, the system boasts an energy saving mode that limits the peak power input of the unit and reduces energy consumption by up to 50%. Additionally, the machine utilizes a die-tying tool for the automatic collection of dices and has been designed to reduce chip and particle carry-over during wafer processing. In terms of quality control, the asset provides users with integrated imageBased inspection and sorting to improve yield and reduce wafer production waste. All major production parameters such as dicing conditions, scriber settings and cutting profiles can be reviewed and changed remotely via Ethernet interface, allowing operators to control the quality and productivity of their dicing operations. Overall, DFL-7160 is a powerful and efficient solution for wafer slicing and dicing that offers users increased accuracy and effeciency, while providing maximum safety and energy savings.