Used DISCO DFL 7160 #9217368 for sale

DISCO DFL 7160 is an advanced scribing and dicing equipment from DISCO Corporation. It is designed to help with high-precision wafer scribing and dicing processes. The system utilizes a high-performance scribing tool and a high-precision dicing blade to achieve excellent chip dicing accuracy, while allowing increased throughput. DISCO DFL7160 features a large and rigid machine frame with integrated structure and built-in controllers for both scribing and dicing functions. On the dicing head, a high-speed, high-accuracy X-Y positioning table is equipped with a high-resolution vision unit. The vision machine is able to quickly detect the position and orientation of the dicing blade relative to the wafer, allowing precise and repeatable dicing operations. The tool includes a digital feedback controller to increase processing repeatability and allow consistent results with each wafer. Furthermore, an individual tool regulation control is also included, which maintains tool parameters, such as drive current and voltage, at preset levels to ensure proper processing with every scribing/dicing operation. In addition, DFL-7160 is also capable of supporting a wide range of wafer sizes, up to 200mm diameter and with a thickness range from 0.15mm to 8mm. In addition, it can be used for a variety of wafer materials, including silicon, gallium arsenide, sapphire, or other compounds. DISCO DFL-7160 is able to provide a high yield of wafer devices thanks to its precise scribing accuracy and dicing precision. Furthermore, it is also able to minimize the potential for wafer damage during the dicing process due to its low cutting force. As a result, the asset is well suited for applications where high yields and product quality are essential, such as the fabrication of semiconductors and other sensitive components.