Used DISCO DFL 7160 #9235149 for sale

DISCO DFL 7160 is a laser scribing / dicing equipment that is used for the processing and packaging of semiconductor wafers. It is capable of cutting high-quality grooves, through-holes and forming fine line patterns into wafers with precision. The system utilizes a 10 Watt CO2 laser beam to achieve the desired results and is highly accurate and repeatable. DISCO DFL7160 features a large aperture window that allows for the laser to reach the necessary processing area. The X-Y worktable can accommodate wafers up to 8 inches in diameter. The X-Y table can move at a maximum rate of 30 inches per second and the laser can operate at up to 3000 Hz pulse frequency. The table has adjustable vacuum pressure for secure holding of the wafers and to ensure that the laser scribing is accurate. The unit includes a dedicated Control Panel for setting laser parameters. The control panel also allows the user to adjust the laser speed, pulse frequency and beam intensity. It also features a range of pre-programmed patterns for various applications. The user can also create their own custom patterns, which can be imported and or exported from the control panel. The machine includes a movable scanner that adjusts the beam to match the groove and or line pattern that is being scribed onto the wafer. This scanner is highly precise, repetitive and reliable for achieving fine resolution processing. It also helps to reduce edge flatness, which is essential for achieving high yield and quality results. DFL-7160 is a user-friendly tool that is designed to reduce maintenance and setup time of the machine. It also features a range of automated safety features that help to protect the user and the machine from potential hazards. Finally, this asset is compatible with most Common Semiconductor Processes such as cutting, dicing, scribing and hole making. This makes it an ideal choice for a variety of industries, such as electronics, aerospace, automotive and medical.