Used DISCO DFL 7160 #9259041 for sale

DISCO DFL 7160 is a complete scribing and dicing equipment for wafer dicing and scribing applications. It is capable of both standard and high-precision scribing, with sharp and clear scribed patterns, and is suitable for use in both research and production applications. The system consists of two components: a laser unit mounted on a component stage and a camera mounted on a separate unit stage. The laser unit utilizes a diode-pumped Nd:YAG laser source to provide up to 3.5 W of power, giving a beam size of 0.5 mm and adjustable repetition rate of up to 50kHz. This allows for perfectly square and straight cuts into wafer pieces with an accuracy of 0.0004''. The camera is incorporated in the machine in order to monitor performance and provide a preview of the cut. The camera is an integrated 512×512 pixel high resolution CCD monitor with a motorized focus to give clear images of the wafer under test. This makes it possible to change the setting, enablling automatic or manual scan speed adjustment, as well as zoom into and out of the image. Moreover, DISCO DFL7160 has a touch screen control panel on the machine body, which allows users to easily adjust parameters and control machine settings. It is equipped with a tool kit that allows for the setup of the laser, the pre-alignment of the wafer to the camera, laser trigger adjustments, and a visualization library for easy setup of laser paths and patters. DFL-7160 also features an auto-alignment tool to ensure that the wafers accurately align to the target cuts. This ensures the asset is able to accurately scribe or dice the wafer for precision patterns. DFL7160 is a remarkable scribing and dicing model and is suitable for a wide range of wafer fabrication applications. The laser power, accuracy of cutting and the equipment's feature-rich options make this a valuable asset for a laboratory or wafer fabrication plant.