Used DISCO DFL 7160 #9267719 for sale

DISCO DFL 7160 is a scribing and dicing equipment released by DISCO Corporation. It is a high-precision system used for cutting and abrading in advanced semiconductor fabrication processes. It is capable of providing accurate laser scribing and high-precision dicing of wafer-level devices. DISCO DFL7160 features a high-performance laser scribing engine, providing high-quality, high-precision scribing with a maximum processing speed of 1,000 mm per second. The unit also features pulse modulation capability, enabling the scribing of uniformly shaped, single-pitch cuts with minimal vibration, as well as laser illumination control for scribing on unevenly illuminated or curved surfaces. The machine further features a highly efficient dicing engine, making it ideal for use in advanced semiconductor fabrication processes. DFL-7160 is capable of delivering a highly accurate, high-precision one-step laser dicing process, capable of achieving accuracies of up to 15 microns across a wafer. Additionally, DISCO proprietary residue-free processing technology and automatic defect skip ensure the highest processing yield. DISCO DFL-7160 is equipped with a large 17-inch display and an intuitive user interface. The tool is simple to set up and operate, while providing real-time data display and feedback. Additionally, the asset features remote diagnostics and maintenance functions, enabling the model to be operated and monitored off-site. DFL7160 is an ideal high-precision scribing and dicing equipment for advanced semiconductor fabrication processes. Its high-performance laser scribing engine and efficient dicing engine capabilities ensure accurate and high-precision processing of wafer-level devices. With its intuitive user interface, remote monitoring and maintenance functions, DFL 7160 is the perfect choice for advanced semiconductor fabrication.