Used DISCO DFL 7160 #9363107 for sale

Manufacturer
DISCO
Model
DFL 7160
ID: 9363107
Wafer Size: 12"
Vintage: 2017
Laser dicing saw, 12" UV Laser head W Shape Wavelength: 355 nm Running hours: 12,103 UV Time: 854 Hours Energy test readings: Frequency (Hz) / Power meter (W) 40 / 9.72 50 / 8.88 60 / 8.23 70 / 7.67 80 / 7.19 90 / 6.83 100 / 6.52 110 / 6.15 120 / 5.96 130 / 5.74 2017 vintage.
DISCO DFL 7160 is a 'scribing / dicing' equipment designed for rapid processing of laser-cut films. It offers scribing rate of up to 1,200 lines per minute and dicing rate of up to 400 pieces per minute. It utilizes laser cutting technology, allowing for precise and repeatable cutting of films and wafers with constant speed and power. The system uses dual high-power 4kW lasers and a pivoting head for scribing/dicing applications. The dual laser heads are able to rapidly scribe sheets up to 500mm x 500mm in size by scanning the material with the laser. The pivoting head allows for laser interaction with the material from all angles, as well as for adjustment of focal length and power. DISCO DFL7160 also features an integrated chip recognition unit, which allows for accurate positioning of the laser head. This ensures that scribe and cut lines are aligned precisely and repeatably. It is also equipped with recipes, which make it possible to program the machine for multiple cuts and scribes simultaneously. DFL-7160 features one of the most powerful laser power sources on the market, capable of delivering up to 4kW of power, meaning it is able to cut up to 400,000mm/s in thickness of up to 4mm. It also has an advanced cooling tool to ensure accurate control of laser temperature for optimal and reliable cutting results. The asset has been designed to be user friendly and easy to use, offering an intuitive user interface with self-explanatory commands and parameters. The unit also includes an instruction manual and safety instructions to make sure that the user is able to work with the model in the most efficient and safe manner. In conclusion, DFL7160 is an advanced 'scribing / dicing' equipment that allows for rapid and precise laser cutting of films and wafers. It is equipped with dual laser heads, an integrated chip recognition system, and powerful laser power source. The intuitive user interface and safety features make it easy and safe to operate.
There are no reviews yet