Used DISCO DFL 7160 #9379056 for sale

DISCO DFL 7160 is a scribing / dicing equipment that is ideally suited for ultra precision cutting and dicing of glass, glass ceramic and silicon-based substrates and is specifically designed for single layer and multi-layer applications. This system is made of advanced features that allow precise and accurate cutting and dicing. It is equipped with a high speed fiber laser which produces a high total power output of 3.5 kW for taking on highly intensive scribing tasks. This unit also has a large-sized area scanner that provides dynamic focusing and precise adjustment for optimizing ablation, ensuring superior mylar film or pellicle cutting. The machine also includes a unique patented fine pitch skip scan capability that allows the fiber laser to adjust focus and alignment within a given die field to further reduce total machining time. This tool can reach sub-100um line width and can process a wide variety of materials and thicknesses for hard and brittle semiconductor materials. In addition, DISCO DFL7160 provides automatic height and tilt adjustments to eliminate cutting errors due to substrate warpage. This asset features an on-board laser power monitor which allows detecting of values of the laser energy that has been delivered to the substrate surface, in order to accurately monitor the amount of energy spending during the process course. Moreover, this model includes a fully integrated image processing and vision equipment that tracks dices and supports automatic die cutting at high precision accuracy level. This system is also equipped with a high-resolution field area camera that can work with die field sizes up to 5㎛ x 5㎛. DFL-7160 is compatible with different foundry compatible dicing tapes and works with 5 to 12 inch substrates. Its capability to process these substrates at a faster rate, while maintaining high precision, makes it an ideal choice for customers looking for high performance, accurate and rapid ablation and dicing.