Used DISCO DFL 7160 #9379871 for sale

DISCO DFL 7160 is a scribing/dicing equipment designed for cutting-edge precision and performance in semiconductor and LED chip-level manufacturing processes. The system features a high-precision scribing technology for precision cutting of semiconductor wafers and LED chips, a dual-laser process for improved cutting accuracy, and advanced imaging and detection systems to ensure perfect results. The scribing process is based on a patented DFL (Direct-Focused Laser) unit with a built-in production cycle monitor for precise cutting. DFL technology provides a highly-accurate scribing operation using advanced optics and direct-focused laser performance, resulting in a greatly-reduced cutting error rate and superior edge profile of the cut patterns during the semiconductor device fabrication. The machine boasts feature-rich applications for pre-cutting, visual inspection, and post-dicing operations. Its highly-integrated design allows DISCO DFL7160 to perform a variety of production processes, including pre-cutting, visualization, dicing, and post-dicing operations. The tool is capable of automatically superimposing a pre-defined cutting pattern over the surface of semiconductor wafer or LED chips, which can then be cut along those pre-defined lines using the dual-laser technology. DFL-7160 also features an innovative cutting width control asset which helps ensure accurate positioning of the cut lines, even on wafers with complex contours or patterns. This feature helps reduce wafer cutting errors, and enhances both yield and production yields. Furthermore, DFL7160 supports advanced imaging and detection technologies for visual inspection in order to ensure the accuracy of each cut line. Additionally, the model provides for post-dicing operations such as adhesive application and handling of scrap and waste products from production. DISCO DFL-7160 has been designed to support the cleanroom environment, and is compliant with safety and quality standards. Overall, DFL 7160 is a reliable and robust scribing and dicing equipment that is suitable for a variety of production processes. Its advanced technologies help ensure maximum throughput, precision, and uniformity in the process of manufacturing semiconductor and LED chips. It is an ideal choice for both small- and large-scale production operations in the semiconductor and LED industries.