Used DISCO DFL 7160 #9392289 for sale

DISCO DFL 7160 is a scribing and dicing equipment developed and produced by DISCO Corporation. The system provides an automated solution for the dicing and scribing of semiconductor wafers. With the capability of slicing wafers of up to 200 mm in size, the unit is perfect for high-volume production lines. The machine is based on a highly accurate, four-axis motion tool that allows for the cutting of wafers to anything from 0.3 mm to 1 mm, with 0.1 Um positional accuracy. It is capable of scribing at speeds ranging from 1 m/s to 10 m/s and with a cutting pitch of up to 10 um. This ensures that the wafers are cut accurately while also maintaining high speed. At the heart of the asset lies a highly advanced computer control model, allowing for accurate motion control and detailed process management. The software features a user-friendly graphical interface with a wide variety of preset process parameters. This allows the user to quickly and easily set up a process, or customise a process to their specific requirements. The equipment also uses a number of automated safety measures to ensure that the process runs as safely as possible. These measures include a multi-sensor mapping system, capable of sensing the wafer state and detecting potential damages, as well as a precise dust collecting unit, to ensure that any dust and debris created during the process is removed from the cutting area. The machine also features a number of additional features such as a chip detector, die-casting detector, and laser cut sensor, which allow for even further quality control. Overall, DISCO DFL7160 is a highly advanced and reliable tool, making it an ideal solution for high-volume production lines. With its wide range of features and capabilities it is well suited for any number of scribing and dicing applications.