Used DISCO DFL 7160 #9392683 for sale

DISCO DFL 7160 is a scribing/dicing equipment designed for die preparation and combination of the dies used in high-precision IC manufacturing processes. The system features a dual-function scribe/dice head that allows the device to operate both as a scriber and a dicer at the same time, allowing for greater productivity and reduced production time in wafer processing. It utilizes a dry-scribing technology that makes use of a laser-beam generated by a UV laser. The laser is directed over the wafer surface, where it is focused to form a beam of approximately 200µm in diameter. This beam is then directed along the surface of the wafer to cut, or scribe, along patterns formed by the CAD data specified by the user. The scribing is further refined by DISCO DFL7160's auto-focusing function, which automatically adjusts the focal depth of the scribing laser beam in order to ensure that the scribes are made within the optimal focal depth range. Following the scribing, the unit uses a vacuum pickup and blade wheel to dice the wafer into individual dies. DFL-7160 utilizes specially designed blades to minimize die edge damage and optimize die strength for increased die yield. DFL 7160 also has an automated defect inspection machine that detects any defects that may occur during the scribing/dicing process, and features a 12-inch color LCD display with touch-control panel that allows for visual inspection and quick parameter settings. Additionally, the tool has advanced productivity functions to enable on-demand production and uninterruptible operation. The asset also incorporates a delamination function that allows the user to separate the dies from the wafer after scribing and dicing. This feature is designed to improve overall processing accuracy and reduce manual labor costs. The model is also designed with safety features, such as a laser optical power monitoring equipment and an interlock-enabled safety cover for the work table. DISCO DFL-7160 is an ideal solution for semiconductor device manufacturers requiring efficient and reliable wafer preparation and die production. The system's advanced features and performance make it an excellent option for manufacturers of highly complex ICs.