Used DISCO DFL 7161 Type K #9120256 for sale

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ID: 9120256
Fully automatic laser wafer saw, 4" - 8" UV Laser: 355nm; laser head in fixed position Chuck table moving in X- & Y-direction Graphical user interface with touchscreen Image processing system with auto focus Fully automatic frame handling system for 6" or 8" frames Wafer cleaning system with atomizing nozzle and rinse cleaning Spinner table for 6" or 8" frames Transformer: 7.5kVA, 400V, 3 Phase, 50Hz Standard accessories Operation manual SEMI Standard / UL BSS4 Optical beam shaping system Quartz chuck table PVA (Hogomax) Spin coating system HASEN Cut Software Customized modification on BCR, wafer ID reader, SECS/GEM Laser run time: 217 hours 2013 vintage.
DISCO DFL 7161 Type K is a scribing/dicing equipment designed for precision trimming and breaking of irregularly shaped wafers. Utilizing a combination of embedded sensing technology, active positioning, and laser scribing components, the system is capable of easily executing one-step dicing processes with a high degree of accuracy and repeatability. DFL 7161 Type K is equipped with a dual-directional mechanism composed of a Z-axis linear drive, along with an arm-based Y-axis drive. This design allows for precision tracing of irregularly shaped substrates along the Y-axis, while the Z-axis drive offers an impressive work area of 160 mm × 80 mm. The unit has a wide set of features to ensure precise trimming and breaking of wafers. Its servo-controlled vibration generator machine can be adjusted to enable different cutting conditions. Furthermore, the dynamic laser power adjustment pr event feedback during processing, reducing thermal effects while ensuring consistent cutting performance. With regard to safety, the tool is equipped with a "Teaching Mode" function which allows the user to remotely monitor the machine operations while in use. Additionally, the automatic shut-off asset located at the end of the Y-axis drive ensures that the machine stops when the end point has been reached. It also incorporates optical beam monitoring and an emergency stop switch in order to help protect operators from any potentially dangerous situations. DISCO DFL 7161 Type K is an all-in-one solution that helps users increase efficiency and accuracy in cutting and trimming operations. It offers high-precision cutting at speeds up to 1,600 scribes per second with its laser generator and F-theta lens. It is also compatible with standard wafer sizes ranging from 2" to 8" so users can effortlessly switch between wafer sizes without any disruption to the process. With its flexibility and reliable performance, DFL 7161 Type K is an ideal choice for any precision scribing/dicing project.
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