Used DISCO DFL 7161 #9146419 for sale

It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.

Manufacturer
DISCO
Model
DFL 7161
ID: 9146419
Wafer Size: 4"
Vintage: 2013
Laser saw, 4" Can be converted to run 8" wafers UV laser with 355nm laser head Wafer material: Ge Hours on the laser: 200 Processing method: Fully automatic Workpiece size: φ300 Chuck table X-axis Processing range: 310mm Max. processing speed: 0.1 - 1000mm/sec Y-axis Processing range: 310mm Index step: 0.0001mm Positioning accuracy: 0.003/310 (Single error)0.002/5mm Z-axis Moving resolution: 0.00005mm Repeatability accuracy: 0.002mm θ-axis Max.rotating angle: 380 deg Crated 2013 vintage.
DISCO DFL 7161 is a sophisticated scribing and dicing equipment, designed to efficiently manufacture intricate patterns in multi-layered substrates. It is capable of creating intricate patterns in a range of thicknesses, materials, and shapes with pristine precision. The machine uses high-speed scribing and dicing technologies to achieve smooth, accurate, and sharp edges. The system consists of a monoblock machine CNC (computer numerical control) unit, which is designed to be relatively easy to use, even for inexperienced users. The CNC machine is powered by three spindles, which are capable of achieving speeds up to 12000 rpm. The motor is also equipped with an encoder, which allows for more precise and accurate scribing and dicing. The CNC tool can be used to precisely shape the cutting tool's path, thereby allowing you to create detailed patterns with precision. DISCO DFL7161 utilizes a laser asset to micro-cut the substrate, thus allowing for the fastest and most precise cutting of substrates. The laser model is equipped with highly accurate optics, utilizes a high powered laser beam that rapidly cuts through multilayer structures, and has a low surface aberrations range. It is also loaded with infrared (IR) power detectors and a BCD (bitmapped coordinate data) equipment for precise and detailed scribing and dicing. The system can also cut a variety of materials, including films, printed circuit boards (PCBs), silicon wafers, and multi-layer substrates. It is capable of cutting substrates at speeds of up to 8000 mm/sec, ensuring superior performance even when cutting materials at higher speeds. In addition to this, the laser unit boasts of having a minimum cutting width of 14 microns and a 50 μm accuracy level. DFL 7161 also features an auto-focus machine, whereby the cutting head is automatically adjusted according to the type of materials and sizes in order to accurately shape the substrate. Moreover, due to its user-friendly design, DFL7161 can be operated by any operator with minimal training. In addition to this, it is equipped with multiple safety and operation features, such as anti-corrosive protective covers, lighting, and dust/gas sensors. Overall, DISCO DFL 7161 is a powerful scribing and dicing tool, designed to offer unparalleled speed, accuracy, and precision for intricate patterns in a variety of materials. Thanks to its cutting-edge technology and user-friendly design, it can be used by any operator, with minimal training, allowing them to achieve professional results quickly and easily.
There are no reviews yet