Used DISCO DFL 7161 #9262967 for sale

DISCO DFL 7161 is a sophisticated scribing and dicing equipment designed for the processing of complex wafers. The system provides accurate scribing and dicing for integrated circuits, micro-mechanical structures, as well as other micro-machines, as well as other precision substrate materials. Equipped with two lasers and two scribes, the unit is suitable for fine-pitch substrates. The lasers are capable of accurately positioning and precisely cutting a variety of materials such as silicon, GaAs, and sapphire. The scribing process can be customized to suite the needs of the particular application, and the machine is easy to configure for different requirements. DISCO DFL7161 works in tandem with a proprietary computer numerical control (CNC) program allowing for detailed setups and laser cut patterns. DFL 7161 has a two-level accuracy tool which uses both coarse and fine tuning calibration to ensure high accuracy cutting. By using a unique cutting algorithm that can generate perfect false kerns, any small change in the cutting pattern can be detected and corrected quickly and accurately. DFL7161 offers a variety of safety features to ensure a safe and efficient operation. With multiple layers of optical cameras and quality control systems, the asset can detect any misalignments and movements before the scribing and dicing process begins, increasing accuracy and ensuring the highest quality of wafers. Additionally, the model is equipped with advanced air filtration technologies to reduce the wear and tear on machine components, creating a clean and safe working environment. DISCO DFL 7161 is designed to be dependable and productive. Its side manipulator feature ensures operational stability and automation, and its cooling equipment ensures optimal performance. The system offers quick setup times, no moving parts, low noise operation, and a full range of precision tools to further ensure the highest quality results. DISCO DFL7161 is the ideal solution for precise and reliable wafer scribing and dicing. With its advanced technologies and features, the unit is sure to offer an efficient, safe, and high-quality processing of complex wafers in any given environment.