Used DISCO DFL 7340 #293592204 for sale

DISCO DFL 7340 is a scribing/dicing equipment used by semiconductor wafer processing companies. It is a high-precision automated dicing process. It is capable of both singulation and edge profiling and can be used for various applications such as laser dicing, grinding and polishing. The system has a large Y-axis traverse area of up to 21.3", a fully programmable 3-axis X-Y-Z motion and a precise and rigid motion unit for minimization of vibration for optimal cutting. DISCO DFL7340 utilizes laser ablation technology using a frequency-doubled Nd:YAG (Neodymium-doped Yttrium Aluminum Garnet) laser. This laser uses a 740nm wavelength, 4ns pulse and a maximum repetition frequency of 20kHz. This allows for clean, precise cutting with no extraneous burrs or material flaking, as well as reduced thermal damage to the material. The machine can be used on a variety of materials, such as Si, SiO2, and Si3N4. The tool is equipped with a vision asset for precise die rotation and fully automated inspection. The vision model is able to detect the individual dies and is able to reject those that don't meet predetermined criteria. This reduces the risk of defective dies being processed, saving time and resources. DFL-7340 is also compliant with the JEDEC Guide 6036 transportable standard, making it compatible with many other industry standard processes and systems, such as the SECS/GEM protocol. The equipment can also be equipped with a dry pump system to reduce contamination risk, which is important for wafer processing applications. Overall, DISCO DFL-7340 is a versatile and reliable unit for precision scribing and dicing. Its laser ablation technology, programmable motion machine, vision-supported automated inspection and compatibility with various standards make it ideal for semiconductor wafer processing companies.