Used DISCO DFL 7340 #293592446 for sale

DISCO DFL 7340 is a computer-controlled semiconductor wafer processing equipment designed for dicing and scribing. It is an advanced system that offers automated, motion-controlled scribing and dicing operations. The unit is equipped with an auto-leveling scribing stage that is capable of handling a variety of wafer sizes up to 8-inch in diameter. It also includes a precision vacuum loading machine to ensure accurate placement of the wafer on the scribing stage. The tool is capable of cutting the wafer into multiple dies (chips) in a parallel fashion at the same time. The asset is equipped with an advanced control software package which aids in executing customized job settings for accurate and efficient processing of the wafer. It also features high scribing/dicing precision with a minimum scribing width of 0.5mm and a minimum cutting grid of 10 mm. In addition, specialized software allows quick adaptation to changing parameters if required. DISCO DFL7340 model is primarily used for scribing and dicing operations in the semiconductor wafer processing industry. It is designed for high-precision scribing and dicing of a variety of materials such as silicon, gallium arsenide, sapphire, and quartz. This equipment is also suitable for other similar applications such as sapphire grinding, etching, and die cutting. The system is equipped with a high-precision fine scriber and a high-power vision-controlled laser scriber/dicer in a moving table. It also has a motion-controlled robot arm with a programmable laser scriber/dicer. The unit is capable of cutting complex shapes with high accuracy and is suitable for achieving limited-space drilling and skiving. Using its automated functions, the machine is capable of self-adapting its settings to material types and handling errors while still ensuring high-quality results. DFL-7340 tool is also designed for safety, security, and maintenance. The asset features a bright layer of stainless steel which is resistant to acids, oxidizers, and wear, also features a compact design for easy installation, an accessible control panel for improved user-friendliness, as well as an optical sensing model that is designed to detect any damage done to the equipment during operation. To ensure the system's accuracy and performance, it comes with a rigorous quality inspection unit which does not allow for any deviation of cutting accuracy beyond fixed parameters. Furthermore, the machine is equipped with a number of built-in features such as dynamic monitoring tool, an optoelectronic capture mechanism, temperature control, and an original asset interface. Each of these functions enhances the quality and precision of the wafer processing. In conclusion, DFL 7340 is a cutting-edge semiconductor processing model ideal for scribing and dicing operations. It is equipped with a range of advanced features that allow it to provide users with the highest level of precision accuracy, safety, maintenance and more user-friendly control software.