Used DISCO DFL 7340 #9160919 for sale

Name: DISCO DFL 7340
Brand: DISCO
SKU: 9160919
Availability: InStock

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Scribing / Dicing

Manufacturer

DISCO

Model

DFL 7340

ID: 9160919

Wafer Size: 8"

Laser saws, 8" SMC HEC006-W2B Thermo-com chiller Processing method: Fully automatic Workpiece size: 8" X Axis (Chuck table): Processing range: 210 mm Max. processing speed: 1~1,000 mm/sec Y Axis (Chuck table): Processing range: 210 mm Index step: 0.0001 mm Positioning accuracy: 0.003/310 mm (Single error) 0.002/5 Z Axis: Moving resolution: 0.0001 mm Repeatability accuracy: 0.001 mm θ Axis (Chuck table): Max.rotating angle: 380 deg Currently installed and warehoused 2009-2010 vintage.

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DISCO DFL 7340 is a scribing/dicing equipment designed for precision lithography. This system combines automated slicing, dicing, scribing, and wafer trimming. It is designed to be used in applications such as semiconductor production, MEMS production, or LCD panel production. DISCO DFL7340 is an automated unit that is capable of performing small scale operations. It is made with a solid granite base for added stability and incorporates a three-axis machine for precise slicing. The cutting table is driven by servo motors for precise depth control. This tool includes a variety of cutting tools for a variety of applications such as cutting die, dicing conductive film, and ablation of silicon. The laser asset utilizes an air cooling model to reduce heat at the cutting surface. This model comes with a CCD camera for accurate alignment and a double cooling equipment for improved safety. The CCD camera quickly aligns the cutting blade to the substrate and the adjustable laser head can be shifted to maximize accuracy. Furthermore, a specialized algorithm ensures high precision during the entire work process. The system also incorporates a high-speed scribing mechanism and supports complex slicing patterns such as die divisions, castellations and chamfers. In addition, DFL-7340 is compatible with a range of other materials, including single or multi-layer ICas and thick-film substrates. The user interface is designed to be easy to use and it can recognize English, Japanese, and Chinese characters. The operating unit for this unit is Windows 2000/XP/NT4.0 and does not require installation. This machine includes convenient facilities for monitoring the processing conditions, such as a monitor for diagonally slicing, a status monitor, and a label monitor for wafer production. DFL 7340 offers a host of features that make it an ideal choice for precision scribing/dicing operations. This tool can perform scribing and dicing operations with precision, speed, and accuracy and can therefore be used in various applications.