Used DISCO DFL 7340 #9195454 for sale

DISCO DFL 7340 is a scribing/dicing equipment designed for semiconductor packaging applications. It is suitable for any dielectric-filled or Cu substrate chip packaging operation. This system includes aluminum and quartz plates, with a thickness range between 1 to 5 mils, along with a maximum dicing table height of 4 inches. The bulky pressure cast aluminum table not only keeps the substrates in place, but also serves as the cutting platform for both scribing and dicing operations. A precision positioning unit with manual and semi-automatic positioning controls is built-in, allowing individual dies to be placed accurately according to the alignment mark. This is essential for any chip manufacturing operations as misalignment in dies can lead to wasted materials and compromised quality. DISCO DFL7340 is powered by a multi-axis motion control machine. It includes an XY-1 servo-motor and a Z axis micropositioning motor, providing stability and accuracy for cutting operations. The XY-1 motor's maximum speed is 0.4 mm/sec, and its repeatability is ±2μm. The Z axis micropositioning motor is capable of a maximum speed of 0.2 mm/sec and a repeatability of ±1 μm. The tool is equipped with an intelligent vision asset to align the dies accurately. It is also equipped with a die pad inspection model, which can detect any die crack or contamination. The most notable feature of this equipment is its capability to perform both scribing and dicing operations. This can significantly reduce the overall time required for the operations. In terms of safety and protection, DFL-7340 comes with an integrated laser safety guard. This feature helps protect operators from potential laser exposure. It also contains a Honeywell 4-channel air bearing system for low contact height, which is integral for smooth and precise cutting operations. Overall, DFL 7340 is a great unit for performing high-precision cutting operations with maximum accuracy and safety. It is highly recommended for production lines in semiconductor packaging industry.