Used DISCO DFL 7340 #9195456 for sale

DISCO DFL 7340 scribing / dicing equipment is an all-in-one laser cutting and dicing system, used for a variety of applications from the production of integrated circuits, to the preparation of optical components, and dicing of hard substrates. The unit is powerful enough to process multiple wafers simultaneously, and can be adjusted for precise control over panels, dice size, and throughput. The machine is built around a high-end cutting head, capable of producing microlens grooves with extremely fine diameter resolution. The cutting head is mounted on a 6-axis kinematic arm, for precise wafer placement, cutting parameters, and dicing/scribing accuracy. The wafer loading table can process up to four wafers at a time, with a 200 mm diameter maximum. The cutting head uses two lasers to produce a laser beam of the desired cutting power: a high power Nd:YVO4 laser, used to shape a microlens groove, and a lower power Nd:YAG laser, used to slice and dice the material. Both fibers lasers are capable of producing high-energy pulses, with pulse duration ranging from 0.1 to 20 µs, allowing for very precise scribing and dicing of materials. The tool's software is stable and user-friendly, with advanced customization options for panel design, pulse width and duration, dynamic speed control, and overall asset performance. In addition, the software includes advanced safety features, such as emergency stop and emergency release of the laser cutting head, to ensure the safety of the operator. Overall, DISCO DFL7340 scribing / dicing model features a powerful Nd:YVO4 laser with excellent accuracy, adjustable pulse width and duration, data-logging capabilities, and multiple wafer loading. It is an ideal solution for applications that require precise cutting and dicing of quality parts.