Used DISCO DFL 7340 #9353049 for sale

DISCO DFL 7340 is a scribing and dicing equipment designed for efficient and precise production of wafers and thin films. It is a fully automated, high accuracy system composed of a precision tilt stage and a laser cutting head. It can be used for various applications including thin film perforation, thin film scribing, laser trimming, device separation, dicing, beveling, scoring, forming and etching. DISCO DFL7340 features an easy to use user interface that makes it relatively intuitive to use, allowing users to set up and manage their cutting processes quickly and easily. The unit is equipped with multiple software features including automatic correction, laser calibration, laser head alignment, auto creation of the process layout, Multi-Cut, Trace & Scan function and CAD file importation. DFL-7340 uses a tilt table to move the substrate during cutting, providing a controlled and precise cutting speed adjustment for a wide range of materials. This tilt table also allows for a wide range of cutting angles, including angled cuts, which are ideal for thin films. Additionally, the machine also has a precision alignment tool which ensures accuracy in the movement of the wafer during cutting. DISCO DFL-7340 has a high actuating speed of up to 600mm/sec, making it highly efficient for a wide range of applications. Additionally, it can handle a minimum engagement width of 0.002mm, and can easily handle the cutting of thin films. DFL7340 is also capable of cutting a wide range of substrates, including plastic, glass, quartz and stainless steel. Additionally, the asset can be customized to accommodate unique substrates if necessary. DFL 7340 is a powerful and versatile scribing and dicing model that provides high accuracy cutting with minimal thermal effect. With its intuitive design and features, it is an ideal solution for production of wafers, thin films, and other intricate components.