Used DISCO DFL 7340 #9358647 for sale

DISCO DFL 7340
Manufacturer
DISCO
Model
DFL 7340
ID: 9358647
Wafer Size: 4"
Vintage: 2012
Laser dicing saws, 4" 2012 vintage.
DISCO DFL 7340 is a versatile scribing / dicing equipment primarily used in the semiconductor industry. It is capable of scribing, dicing, cutting, polishing, and coating samples with great accuracy and speed. The system features a powerful inline, carbon dioxide laser-driven scriber/dicer, two spindle cleaners, and two polishers. The inline laser-driven scriber/dicer features a vibration and torsion-free unit that ensures accurate cutting and scribing. It can quickly and easily adjust the cutting depth and angle of the sample, while providing superior accuracy and precision. The two spindle cleaners provide a single processing line that can easily be programmed to clean, grind, and polish the surface of a sample. This feature is especially useful for removing residues, such as paint and adhesives, from semiconductor samples in one easy automated step. The two polishers are designed to provide superior surface integrity and smoothness. They include a variety of grinding and polishing modes that can be selected according to the desired level of detail and fineness. The computer-controlled machine offers maximum flexibility for automated processing by providing a wide range of programming options including repeat cut precision and motion speed adjustment. A built-in memory capacity stores up to 32 programs and a learning mode allows users to fine tune setup parameters and best parameters to achieve the desired results. The tool includes additional features such as an external cassette loader and unloader and a door safety interlock. The graphical user interface is capable of displaying a variety of information, including run information, total pieces, laser settings, and machine settings. DISCO DFL7340 provides precise, fast, and accurate processing of electronics or semiconductor samples. Its powerful inline laser-driven scriber/dicer, two spindle cleaners, and two polishers improve quality and finish of samples, while providing flexible programming for precise repeat cutting. Its range of features ensures reliable and efficient operations, making it an ideal tool for automated semiconductor processing.
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