Used DISCO DFL 7340 #9379119 for sale

DISCO DFL 7340
Manufacturer
DISCO
Model
DFL 7340
ID: 9379119
Laser dicing saws.
DISCO DFL 7340 is a modular end-to-end "scribing / dicing" equipment for primarily medical and industrial applications. A DISCO DFL7340 system typically consists of an integrated frame, automation unit, and multiple process and support tooling components. The machine is designed to precisely scribe and dice wafers and dies in various compositions, such as glass, ceramic, sapphire, and silicon. It is a precision production grade robot tool with a high level of accuracy and repeatability to ensure product quality. The integrated automation asset includes an industrial PC, actuator, controller, and camera model as necessary. Automation capabilities from single-axis through high-speed 6-axis robots are available, enabling accurate and repeatable scribing and slicing. It can also be configured for automated loading of wafers and dies into the equipment for increased throughput and reduced labor costs. The precision tooling used with this system is designed to accommodate various scribing and cutting requirements. It includes high-speed scribing spindles, diamond cutters, high-precision vision systems, and custom scribing and mounting plates. A variety of tooling accessories can also be used to accommodate custom processes and designs. The parts can be processed via wet or dry processes and a range of cutting tools such as lasers and diamond cutting blades can be used. The integrated vision unit in the machine allows for accurate scribing and cutting of the material with real-time feedback. This tool uses the latest vision sensing technology to ensure the accuracy of the scribing and cutting operation. The vision asset is capable of measuring position, angle, offset, and depth of the material. It can detect any anomalies and can make real-time adjustments to compensate accordingly. DFL-7340 model is an ideal production grade solution for medical, industrial, and other precision cutting applications. The equipment is easy to configure and customise for various wafer and die shapes and sizes. It is cost-efficient and provides consistent high-level accuracy and repeatability, making it an ideal solution for a variety of precision scribing and dicing production applications.
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