Used DISCO DFL 7340 #9384710 for sale

DISCO DFL 7340 is a scribing/dicing equipment designed for cutting, slicing, and dicing of thin-film substrates. It is a high-performance multi-tasking system with a throughput of up to 60 wafers per hour and is ideal for processes involving ultra-low force cutting and dicing of thin film materials such as glass, ceramics and GaAs. The machine consists of an integrated unit of advanced optical and mechanical components which enable precision cutting and slicing. An integrated machine of CCD cameras, laser optics and advanced control systems provides an efficient cutting tool for laser scribes and diamond dicing. The integrated asset provides the function of the entire cutting process, from slicing and dicing of the substrate to aligning and trimming the cut pieces. The cutting model is based on a mean of advanced laser optics and is powered by femtosecond laser technology. The equipment is equipped with powerful software for automatic fine-dicing of even the thinnest films with minimal force, resulting in increased speed and accuracy. The system also includes advanced laser optics for precise cutting, allowing for ultra-small feature sizes with minimal substrate damage. In addition, the advanced optics allow for more efficient cutting with better tolerances and faster slicing, allowing for higher precision parts with reduced fabrication costs. In addition, DISCO DFL7340 is designed for maximum versatility. It is equipped with a number of microscope adapters to facilitate different methods of micro-fabrication and different cutting tools. The unit is also capable of cutting a wide range of materials and substrates, including films, wafers, and thin films. Lastly, it is also capable of cutting multiple substrates simultaneously, making it ideal for mass production. Overall, DFL-7340 is a powerful, multi-tasking machine designed for high-precision cutting and slicing of thin-film substrates. It is equipped with advanced laser optics, software and microscope adapters to provide efficient and accurate cutting. This advanced cutting tool is designed for faster, more precise slicing and dicing, and allows for the production of high-quality parts with reduced fabrication costs.