Used DISCO DFL 7340 #9402667 for sale

Manufacturer
DISCO
Model
DFL 7340
ID: 9402667
Vintage: 2011
Laser dicing saw 2011 vintage.
DISCO DFL 7340 is a scribing / dicing equipment designed to produce high-accuracy and high-performance thin film packages and replace more traditional package singulation methods. With its advanced multi-axis feed system and precise and high-speed controller, it is capable of cutting and scribing thin film packages with precision accuracy and repeatability. The unit utilizes fine-grain linear motors to enable fast scanning and improved accuracy. A flexible thin film array and an overhead spindle provide accurate 6-axis motion for precise and efficient operation. The spindle-drive is reliably powered by an ultra-high speed power supply and a dedicated high-speed drive amplifier. The synchronized motion of the array is made possible by the use of piezo stepper controllers and fully programmable step sizes, enabling multiple cuts and scribing on a single pass. The scribing of the thin film package is done using the plasma-knife technology, which enables precise trench cutting and precise layer separation. This technique optimizes layer thickness and helps ensure precise chip placement when cutting and scribing. The plasma-knife tool is implemented under a vacuum to reduce scattering of the plasma and eliminate deformation of the thin film. The machine utilizes a comprehensive design software with a well-structured graphical interface. The software is designed to facilitate precise programming of commands, configurations and Material-Specific Parameters (MAPs). The software also supports loading and saving of CAD drawings and accurately calculates the cutting and scribing sequence. For convenience and ease of operation, the tool comes with an intuitive and user-friendly control panel with plain-language commands. It also has a safety guard interlock that ensures safety by automatically stopping the asset when the guard rails are opened. Overall, DISCO DFL7340 is a highly versatile scribing / dicing model that offers precise and accurate cutting and scribing of thin film packages. The features of the equipment such as the plasma-knife technology, the flexible thin film array, the high-speed power supply, the 6-axis motion and Software, and the intuitive control panel, make it an ideal choice for producing high-precision packages.
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