Used DISCO DFL 7341 #9162111 for sale

DISCO DFL 7341 is a precision scribing/dicing equipment used for high throughput cutting of substrates such as glass, silicon wafer, quartz, plastics, ceramics, and other semiconductor materials. It features an outstanding speed of cut, high accuracy, a wide working area and long life-span abrasive blades. One of its main features is a long stroke ultrasonic scriber, which allows for cutting at veryhigh speed. It is designed to provide ultra-precise scribing and dicing in a single pass, with a maximum accuracy of 10 microns. In addition, the system also has a long working area of up to 420mm x 420mm and is capable of processing substrates from 0.01mm up to a thickness of 160mm. Another outstanding feature of DISCO DFL7341 is its long-life abrasive blades, which allow for tens of thousands of cuts before needing to be replaced. Moreover, the unit is able to accurately and quickly make long or short-line scribes, as well as pattern-type cuts. Furthermore, the machine is equipped with a multi-level dust collection tool, preventing the dispersion of abrasive particles and other work pieces. Additionally, the asset uses a proprietary Software Protocol Suite (SPS), providing users the ability to control the scribing/dicing process. This includes the ability to create custom profile and cut patterns, edit user-defined dicing patterns, and monitor the cutting progress through the graphical user interface (GUI). DFL 7341 is able to process a variety of materials with different thicknesses, making it applicable to a wide range of applications. Therefore, it is an ideal choice for automation-based and precision dicing and scribing processes at high throughput. The reliability and dependability of the model ensures that users can achieve a high-level of precision in a short period of time.