Used DISCO DFL 7560 #9364772 for sale

DISCO DFL 7560 scribing and dicing equipment is a high performance, automated component handling system. Its main purpose is to scribe and dice a variety of components, with a wide range of sizes, shapes and material qualities, from small pieces of dielectric material to larger, complex 3D components. The unit offers a range of features and functions to ensure that the cutting process is precise and efficient, such as a powerful vectoring engine, automated XY and Z axes control, and an optimized path selection algorithm. The scribing and dicing process with DFL 7560 is accomplished using a CO2 laser, which precisely scribes or dices the components with minimal impact on material properties. The laser features a wavelength of 9.3 microns, and an average power output of up to 25 Watts. The laser is capable of marking, drilling, trimming, edge-grinding and abrading to create the desired cut. The machine also has adjustable focus and depth control parameters to ensure optimum cutting results. DISCO DFL 7560 is extremely precise and accurate, with a minimum spot diameter of 18 microns and a positional precision of up to 6 microns. The tool also features a selectable scanning speed of up to 500 Hz. Its combination of features ensures that intricate details and complex geometries can be scribed or diced with precision. Additionally, a quality assessment asset is built-in, ensuring that only components that meet the required specifications are accepted. This model can check a component's size, shape, surface finish and cavity depth. If any of these parameters are outside the specified tolerances, the component is automatically rejected. Overall, DFL 7560 scribing and dicing equipment is an exceptional automated component handling system, offering a wide range of features and functions for precise, fine-scale control of the cutting process. Its combination of powerful laser technology and quality control features ensures that the precise, accurate cuts that are required for today's complex products can be achieved.