Used DISCO DFM 2700 #293753423 for sale

DISCO DFM 2700 is a high performance scribing and dicing equipment from DISCO, a Japanese manufacturer of technologically advanced semiconductor equipment. The system is designed to efficiently and accurately cut, divide, trim and finish substrates with extremely precise results. The machine features a compact footprint and incorporates advanced features including an integrated closed loop servo control unit and high resolution, precise machine control. The machine is also equipped with a intelligent control tool to accurately control blade settings and to optimize asset performance. The front-end stage consists of two mechanical parts - a frame to balance the forces and a scribing table. It facilitates the precise cutting of semiconductor wafers as thin as 150 μm. The back-end stage comprises a dicing table with a cooling function and a pressure control model to ensure precise dicing. The machine has a higher capability for stress control compared to its predecessors, and it is capable of processing the latest ultra thin wafer sizes. DISCO DFM2700 can process wafers from 8" to 300mm in size and offers best in class throughput and yield performance. The machine is compatible with quartz, polyolefine, polyimide and rigid carrier substrates. It can produce cuts as small as 50 μm with an extremely high accuracy of 0.03μm in x-y direction and 0.01μm in theta direction. The equipment is also equipped with a laser interferometer for measuring the cutting accuracy and a dedicated system to check the flatness of the substrate. DFM 2700 is the perfect solution for semiconductor manufacturers who need precision and speed in cutting, scribing and dicing their wafers. The unit is both highly reliable and economical, making it the ideal solution for today's demanding scribing and dicing requirements.