Used DISCO DFM 2800 #9144278 for sale

DISCO DFM 2800 is a scribing and dicing equipment designed for use in semiconductor fabrication. The system is capable of handling a variety of materials ranging from silicon, gallium arsenide, and III-V compounds to polymers and printed circuit boards. The unit helps to quickly scribe wafers for singulation before they are diceted and diced into smaller wafer dies. It has advanced motor technology and LASER positioning machine for precise scribing and dicing. The tool is equipped with a number of specialty diamond tools for optimum performance on a variety of materials. DFM 2800 has a wide range of features to help optimize productivity and results. It has a four-axis cutting asset that can make cuts at angles up to 45°, as well as a wall following model that can maintain a consistent cut depth and profile. It also features a unique multi-pass cutting method that automates the cutting process to ensure less heat buildup and damage, providing a clean finish. The equipment is compact, boasting a small overall footprint with a large working area. It has an adjustable workspace that can accommodate different materials and sizes, and a workpiece fixturing system that adjusts the working height of the substrate easily. A built-in monitoring unit ensures that parameters remain within predetermined parameters to ensure the highest precision. The machine also comes with a number of safety features, like door interlocks, to protect both operators and machinery. DISCO DFM 2800 is a powerful and reliable tool with advanced features that make it an ideal choice for advanced scribing and dicing applications. Its ability to work on a variety of materials, combined with its range of features, results in quick and accurate results, regardless of the project. It is capable of providing fast yields and high quality results for any application.