Used DISCO DFM 2800 #9164893 for sale

DISCO DFM 2800 is a scribing and dicing equipment capable of precision fabrication to micron-level accuracy. The system, which consists of a wafer cleavage stage, scribing arm, and dicing head, enables users to smoothly and precisely dice and scribe a range of semiconductor substrates. The robust design of the scribe head enables stability and accuracy over the full mixture of wafer sizes and thickness. DFM 2800 utilizes a combination of XY positioning and linear drive systems that work in tandem to maintain a level scribing tip pressure over its entire range of motion. This ensures a consistent cut throughout the entire slicing process. The scribe arm is driven by a servo-positioning mechanism for high speed as well as minimum detachment forces, resulting in less residual stress and no chipping at the edges of the scribed line. An innovative harmonic drive delivered power to the scribing arm allows for smooth and precise cutting and reduces the axial inclination of the scribing arm. DISCO DFM 2800 also features an advanced vision unit with a high-resolution camera mounted on a reliable pressurized air bearing spindle, allowing the machine to take accurate measurements of each cut without sacrificing accuracy or speed. The state-of-the-art vision tool also allows the asset to rapidly take in-wafer images through its vibrant LED illumination sources which are used to accurately measure and check the cutting performance. DFM 2800 model is designed to achieve optimal productivity with the minimum maintenance requirements. The equipment operates on a four-axis frame structure to reduce vibrations and avoid chipping at curvature points, while the wafer clamp arm operates in a radial plane to provide the necessary tension to the wafer surface. This also decreases stickness and recoil at the sliced edges. DISCO DFM 2800 is an all-in-one solution capable of processing a wide range of substrates including silicon, glass, plastic, ceramic, and gallium arsenide. The system is equipped with temperature control technology, allowing for faster and more accurate cutting of thick substrates as well as providing a more stable application of adhesive to the thin films and ensuring even scribe lines. The unit also features a powerful, high-sensitivity CCD camera to ensure highly accurate images through its automated focus machine. Overall, DFM 2800 is the ideal tool for precision fabrication applications requiring an accurate, reliable, and low maintenance solution. From its state-of-the-art vision asset to its robust design, DISCO DFM 2800 is designed to meet all the needs of any cutting application. Its reliable performance ensures users can be confident in the accuracy and quality of their sliced and scribed surfaces.