Used DISCO DFM A150-DI #9001239 for sale

DISCO DFM A150-DI is a multifunctional scribing/dicing equipment that can meet the demanding requirements of advanced dicefab and semiconductor processes. This fully automated system boasts a wide range of features, unsurpassed precision and speed. The A150-DI is a high speed and precision scribing unit. The photosensor-based laser scanning range up to 20X larger than other conventional systems combined with its patent-pending line scribing technology, allow for an extremely accurate performance. With a large stroke of 150mm x 150mm and velocities up to 15m/s, the scribing head is powerful enough to handle the toughest die cuts, even with complex chip contours. This machine further benefits from the inclusion of a dust-free environment which ensures a clean, precise process. In terms of dicing capabilities, the A150-DI offers unparalleled die-to-wafer registration for a perfect contact between the die and the substrate. It offers an advanced fine-positioning tool for precise alignment of the die and a high-speed air bearing-based wafer stage. It also features a closed loop drive asset for improved accuracy and advanced stage control for die-to-wafer registration. The A150 DI is further optimized to achieve the most accurate dicing and scribing results, thanks to its advanced built-in control and the dedicated 300mm wafer stage. The model also includes advanced laser recognition which greatly reduces cycle time and minimize die degradation. Moreover, this equipment boasts a user-friendly operating system and GUI, making it easy to learn and use. The A150-DI also helps to improve throughput and yield, as well as reduce cost per die due to its high-speed performance and laser-controlled cutting. In conclusion, DFM A150-DI is an advanced and reliable scribing/dicing unit that provides outstanding accuracy and performance in semiconductor and diefab processes. Its wide range of features, high speeds and precision make it an ideal solution for any professional.