Used DISCO DFM M150 #293589848 for sale

DISCO DFM M150 is a precise scribing and dicing equipment designed for high-speed, precise cutting of semiconductor wafers and other thin materials. The system is capable of scribing 150 mm round, rectangular, or other custom shapes in any material up to 0.76 mm thick. The unit utilizes a pneumatically-powered scribing head with a purge gas to achieve precise cutting with minimal damage to the material. For scribing, the machine is equipped with a specially-designed, high precision, air-cooled diamond scribing head used to score and remove the thin material. The scribing head utilizes a precision guide tool to ensure accuracy of the scribe lines, producing scribe lines with a width of 0.1 mm. The purge gas helps to keep the cutting temperature low and reduce contamination. The air-cooled scribing head is also used for dicing, in which the material is divided into pre-determined shapes. The asset utilizes a high-speed dicing saw, called a "head", to cut through the material. The tilt and depth of the saw can be adjusted, allowing the user to customize the dicing pattern to the size and shape of the material, such as round or square shapes. The model is also equipped with an advanced controller that allows for automated control of start/stop, fine move control, air pressure, and other parameters. The display also provides feedback on the cutting processes, such as throughput, average cutting speed and accuracy. DFM M150 is a powerful and precise equipment designed to provide high-precision cutting of a wide variety of materials. As a result, it is ideal for the semiconductor industry, as well as medical and research fields. The system is durable, easy to operate and maintain, and can quickly and accurately produce consistently high-quality scribing results.