Used DISCO DFM M150 #9074744 for sale

DISCO DFM M150 scribing/dicing equipment is a highly automated scribing and dicing system geared toward semiconductor chip manufacturing. It is designed to quickly and accurately divide silicon wafers into segments for dicing and scribing operations. The unit consists of an integrated high-speed marking head, a motion drive machine, an integrated laser camera vision tool, an inert laser scriber, and an assigned PC laptop. This combination allows for rapid wafer orientation, width adjustment, and registration Corrections. DFM M150 has a versatile and powerful motion drive asset that is designed to meet a variety of needs in the scribing process. The motion drive components are driven by high-torque brushless servo motors for fast positioning, optimal precision, smooth movement, and low noise. The integrated laser camera vision model captures images of the wafer and precisely positions the wafer using the mark, align, and Registration Autocorrect (MAR) equipment. This system reinforces the precise positioning of the wafer by using precise positioning feedback signals from the MAR unit. The MAR machine also makes corrections for any wafer movement that may occur during the scribing process, ensuring accuracy and precision. The integrated high-speed marking head ensures that the scribing lines are always accurate and uniform. It is able to mark four lines simultaneously and can easily cut through silicon wafers up to 200 microns thick. The marking head is able to quickly and accurately scribe across different substrates in the semiconductor industry, including GaAs, SiC, ceramic, glass, and polyimide. Finally, the inert laser scriber is a brushless, high powered, ultra-clean scribing tool that can scribe with less than 0.2µ of depth tolerance. The inert laser makes sure the scribing is as accurate as possible and can be adjusted and controlled in order to ensure proper depth for each scribed line for each application. Overall, DISCO DFM M150 is a reliable and efficient scribing and dicing asset that is designed to improve production rates in semiconductor fabrication operations with its precision alignment, fast speeds, and low noise.