Used DISCO DFM M150 #9115276 for sale

Manufacturer
DISCO
Model
DFM M150
ID: 9115276
Wafer mounter.
DISCO DFM M150 is a high-quality scribing and dicing equipment designed for various industrial processing needs. The system is designed to process a wide variety of materials including silicon, metals, and other hi-tech ceramics. It utilizes a combination of precise optics, laser-based technologies, and advanced motion control algorithms to precisely control the laser dicing process. The unit is equipped with a high-resolution microscope to enable precise analysis of the workpiece during the cutting process. The machine is particularly suitable for cutting hard materials and for applications with tight tolerances and minimal debris. It features high-precision laser dicing, cutting speeds of up to 10 m/s, a quick-change tooling tool, a high-torque motor, and a user-friendly touch-screen interface. The asset is also equipped with a comprehensive safety kit to ensure safe and secure operation. DFM M150 utilizes a high-power, ultra-short pulse laser that is adjustable to match the materials being cut. The high-resolution microscope enables accurate measurement of the dicing grid, as well as providing a visual indication of the status of the cutting process. Furthermore, the cutting speed can be adjusted to match the material being cut, while the motion control algorithms ensure high accuracy during the cutting process. The model also features automatic tool changes and a servo-driven rotary table that enables efficient processing of large-diameter wafers. Additionally, the robust design of the equipment ensures a longer service life and allows for extended maintenance cycles. Overall, DISCO DFM M150 is an advanced scribing and dicing system that is suitable for use in various industrial processing applications. With its intuitive user interface and its high precision and accuracy, the unit is an excellent choice for precisely cutting hard materials and achieving tight tolerances.
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